The Effect of Catalyst Sublimation Temperature on the Purity of Multi-Walled Carbon Nanotube Vertically Aligned Arrays

Kimberly Scheider
Current thermal interface materials including solders, greases, and phase change materials do not have the mechanical compliance required to fill cavities, and thermal conductance necessary to dissipate heat generated in modern microelectronic devices. The inability to dissipate heat properly from the microprocessor device creates a thermal bottleneck which limits device efficiency and leads to early life degradation. Individual multiwalled carbon nanotubes have a high thermal conductivity on the order of 3000 W/(mK) which far surpasses...
This data repository is not currently reporting usage information. For information on how your repository can submit usage information, please see our documentation.