Observations of microstructure evolution and damage of SAC305 solder alloys during thermal and mechanical loadings

Tianhong Gu
Creep of directionally solidified Sn-3Ag-0.5Cu wt.% dog-bone samples with a controlled <110> or <100> fibre texture is investigated under constant load tensile testing (stress level: 17 - 44 MPa) and at a range of temperatures (298 – 473 K). The tensile creep strain rate and the localised strain gradient are studied by two-dimensional optical digital image correlation. A transition of creep mechanisms from climb-controlled dislocation creep to lattice-limited diffusion creep is found beyond ~ T/T_M...
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