SPICE-Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications

Michael Stelzer
Nondestructive material testing and diagnostics play an important role in reliability analysis, component wear-out testing, life-cycle estimates, and safety inspections. Of the several techniques available for nondestructive inspections, thermal analysis has been chosen to be the focus of this thesis research. An equivalence between the system of equations for the heat flow problem, and the variables of circuit theory suggests that an electrical model can be constructed to represent the actual thermal system. This electrical...
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