Hyperspectral analysis of lacquer peel profiles as quasi-in-situ analysis for tailings exploration

Wilhelm Nikonow & Dieter Rammlmair
Three lacquer peel profiles were prepared from a copper tailings deposit in Central Chile. The peels were taken from two sides at varying depths of the tailings heap. Parallel to that, samples were taken from each layer within the peels for bulk XRF analysis and particle size analysis. The peels were analysed by Hyperspectral Imaging (HSI, VNIR- SWIR, 400 – 2500 nm wavelength) with the Specim SisuRock system and µXRF mapping using M4 Tornado Plus...
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