P2.1.22 The ubiquitous technology for prototype and disposable bio-chemical sensors packaging

Dumitu Ulien, Elena Ulieru, Adrian Tantau & Florian Pistritu
A new packaging process for silicon-based chemical sensor arrays has been develop using semiconductor, thick film, and flip-chip technologies. Passive sensors are fabricated on silicon in a semiconductor process compatible with the incorporation of on-chip electronics. Sensor-specific polymer membranes are screen-printed directly onto individual electrode sites. Substrates with flow channels are made from glass using semiconductor process technology. Sensor chips are mounted onto the substrate using a flip-chip approach in which the fluid channels are...