2.3 - Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process

M. Krueger & I. Herrmann
In order to achieve substantial cost reduction for far-infrared focal plane arrays (FPA), consequent adoption of existing high-volume MEMS processes is required. For that reason we used a high-volume pressure sensor process for fabrication of thermodiode FPA. While 1st Gen FPA successfully proved the suitability of the fabrication process, performance was strongly improved for the 2nd Gen FPA to meet customer demands for low-cost thermal imaging and thermal sensitivity of 270 mK @ f/1.0 and...