B4.1 - Trends in Assembly and Packaging of Sensors

Juergen Wilde
In this paper, some trends in the industrial assembly and packaging of sensors are described. We confine the analysis mainly to multifunctional housing technologies. In detail transfer moulded and pre-moulded packages, moulded interconnect devices and LTCC housing are compared. In the case of moulded packaging, multi-chip solutions for SiP as well as chip-scale packages are noteworthy. For pre-moulded housings of single components packages with standard outlines are used, while for sensor systems in mechatronics application-specific...