P6.6 - Integrated Package Modules for Power and Sensor Applications

A. Longford, D. Federici & J. Lynch
Developing technologies continue to demand performance extremes from electronic module designs. Applications for multiple chip packages, power conversion and generation, MEMs devices, Solar, LED and Automotive Interfaces are seeing needs for improved thermal dissipation, resistance to shock and extended environment protection. As requirements become more demanding and raw material costs are increasing the needs to enhance device performance continue to challenge packaging designers and manufacturers. Both power and sensor modules are now taking advantage of...