B3.2 - A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers

F. Roscher, A. Otto, R. Döring, S. Rzepka, M. Wiemer, M. Ihle & St. Ziesche
In this work, we will describe a promising procedure for the development of a silicon based micro electro mechanical system (MEMS) suitable for 300°C operation temperature. Design aspects as well as a suitable packaging concept and technology will be highlighted. The value of accompanying FEM simulations together with the usage of novel reliability tools will be demonstrated as a design and construction accelerator that can help to avoid typical mistakes within the material selection and...