B3.3 - Properties of a novel silver sintering die attach material for high temperature - high lifetime applications

S. Kraft, S. Zischler, N. Tham & A. Schletz
Silver sintering technology has proven to be a high reliable alternative for solder die attaches as well as wire bonding. Previous work at Fraunhofer IISB showed as well a rise in passive temperature cycling capability as in active temperature cycling lifetime with power electronic test modules compared to soldered and wire bonded samples. Since it is a new die attach technology, the material’s properties are still not yet well know. In this work, the Young’s...