B4.4 - New Packaging of Flow Sensors with Monolithic Integration of Micro-Channel on Chip

Sophie Billat, Kurt Kliche, R. Gronmaier, J. Auber, Frank Hedirch, Matthias Ashauer & Roland Zengerle
We report on the integration of a micro flow channel with a thermal flow sensor chip. Two different technologies were investigated: First the fluid channel is performed at the back side of the standard HSGIMIT flow sensor chip using standard silicon etching process (KOH and RIE). The second technology consists of a bond process between the flow sensor die and a polydimethylsiloxane (PDMS) sheet containing the channel. Both sensor types can be used for detecting...
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