Compression–decompression modulus (CDM) – an alternative/complementary approach to Heckel’s analysis

Devang B. Patel, Vivek D. Patel, Yash Patel, John C. Sturgis, Robert Sedlock & Rahul V. Haware
The novel modulus-based approach was developed to characterize the compression behavior of the materials and how it results into tablet mechanical strength (TMS) of the final tablet. The force–displacement profile for the model materials (Vivapur® 101, Starch 1500®, Emcompress®, and Tablettose® 100) was generated at different compression pressures (100, 150, and 200 MPa) and speeds (0.35, 0.55, and 0.75 m/s) using compaction emulator (Presster™). A generated continuous compression profile was evaluated with Heckel plot and...
1 citation reported since publication in 2022.
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